2022年芯片和科学法案-中译(1) CHIPS and Science Act of 2022
CHIPS and Science Act of 2022
2022年芯片和科学法案(核心条款)
Table of Contents 目录
DIVISION A - CHIPS ACT OF 2022
DIVISION B - RESEARCH & INNOVATION
TITLE I - DEPARTMENT OF ENERGY SCIENCE FOR THE FUTURE
TITLE II - NATIONAL INSTITUTE OF STANDARDS AND TECHNOLOGY FOR THE FUTURE ACT
Subtitle A – Appropriations
Subtitle B – Measurement Research
Subtitle C – General Activities
Subtitle D – Hollings Manufacturing Extension Partnership
Subtitle E – Manufacturing Usa Program
TITLE III - NATIONAL SCIENCE FOUNDATION FOR THE FUTURE
Subtitle A – Preliminary Matters
Subtitle B – Stem Education
Subtitle C – Broadening Participation
Subtitle D – Research Security
Subtitle E – Fundamental Research
Subtitle F – Research Infrastructure
Subtitle G – Directorate For Technology, Innovation, And Partnerships
Subtitle H – Administrative Amendments
TITLE IV - BIOECONOMY RESEARCH AND DEVELOPMENT
TITLE V - BROADENING PARTICIPATION IN SCIENCE
Subtitle A – Stem Opportunities
Subtitle B – Rural Stem Education Research
Subtitle C – Msi Stem Achievement
Subtitle D – Combating Sexual Harassment In Science
TITLE VI - MISCELLANEOUS SCIENCE AND TECHNOLOGY PROVISIONS
Subtitle A – Supporting Early-Career Researchers
Subtitle B – National Science and Technology Strategy
Subtitle C – Regional Innovation
Subtitle D – Research Security
Subtitle E – Coastal and Ocean Acidification Research and Innovation
Subtitle F – Interagency Working Group
Subtitle G – Quantum Networking and Communications
Subtitle H – Blockchain Specialist
Subtitle I – Partnerships For Energy Securityand Innovation
Subtitle J – Energizing Technology Transfer
Subtitle K – Micro Act
Subtitle L – National Nuclear University Research Infrastructure Reinvestment
Subtitle M – Steel Upgrading Partnerships and Emissions Reduction
Subtitle N - Applied Laboratories Infrastructure Restoration and Modernization
Subtitle O - Department of Energy Research, Development, and Demonstration Activities
Subtitle P - Fission for the Future
TITLE VII - NATIONAL AERONAUTICS AND SPACE ADMINISTRATION AUTHORIZATION ACT
Subtitle A - Exploration
Subtitle B - Science
Subtitle C - Aeronautics
Subtitle D - Space Technology
Subtitle E - STEM Engagement
Subtitle F - Miscellaneous
DIVISION C - SUPPLEMENTAL APPROPRIATIONS TO ADDRESS THREATS TO THE SUPREME COURT OF THE UNITED STATES
第一章2022年芯片法案
第二章研究和创新
第I节 未来能源科技部
第II节 国家未来标准和技术研究法案
第A小节 拨款
第B小节 测量研究
第C小节 一般活动
第D小节 霍林斯制造业扩展合作伙伴关系
第E小节 美国制造创新项目
第III节 国家未来科学基金
第A小节 基础事项
第B小节 科学、技术、工程、数学教育
第C小节 扩大参与
第D小节 研究安全第F小节研究基础设施
第G小节 技术、创新和伙伴关系理事会
第H小节 行政修订案
第IV节 生物经济学研究和发展
第V节 扩宽科学领域的参与度
第A小节 科学、技术工程和数学机遇
第B小节 农村科学、技术、工程和数学教育研究
第C小节 MSI科学、技术、工程和数学成就
第D小节 打击科学领域的性骚扰
第VI节 杂项科学和技术规定
第A小节 支持早期职业研究人员
第B小节 国家科学和技术战略
第C小节 区域创新
第D小节 研究安全
第E小节 沿海和海洋酸化研究与创新
第F小节 机构间工作组
第G小节 量子网络和通信
第H小节 区块链专家
第I小节 能源安全和创新合作伙伴
第J小节 推动技术转化
第K小节 微电子法案
第l小节 国家核能大学研究基础设施再投资
第M小节 钢铁升级伙伴关系和减排
第N小节 应用实验室基础设施恢复和现代化
第O小节 能源研究、开发和示范活动部
第P小节 面向未来的分支
第VII节 美国国家航空和航天局授权法案
第A小节 探索
第B小节 科学
第C小节 航空学
第D小节 空间技术
第E小节 科学、技术、工程和数学相关
第F小节 杂项
第三章 解决美国联邦最高法院所面临威胁的补充规定
Sec. 101—Short title.
This Act may be cited as the “CHIPS Act of 2022.”
第101条短标题
本法可以简称“《2022半导体法案》”。
Sec. 102—Creating helpful incentives to produce semiconductors (CHIPS) for America fund.
第102条为美国基金创造半导体（芯片）生产的有利激励措施。
In order to support the rapid implementation of the semiconductor provisions included in the Fiscal Year (“FY”) 2021 National Defense Authorization Act (“NDAA”), this division would provide $52.7 billion in emergency supplemental appropriations. The language would also re-affirm that the purchase of stocks and dividends are not an eligible use of CHIPS funds as determined by the eligible use of funds already required under the FY21 NDAA.
为加快实施2021财年《国防授权法案》关于半导体的规定，该行业将提供527亿美元的紧急补充拨款。监管机构的措辞也将进一步表明，购买股票和红利不符合2021财年《国防授权法案》已经规定的半导体基金所资助的合格用途。
Funded activities include: 基金资助的活动包括：
·$50.0 billion allocated over 5 years for a CHIPS for America Fund. Funding must be used to implement the Commerce Department semiconductor incentive—to develop domestic manufacturing capability—and research and development (“R&D”) and workforce development programs authorized by the FY21 NDAA (Sec. 9902 & 9906). Each fiscal year, up to 2 percent of funds are made available for salaries and expenses, administration, and oversight, of which $5 million is available each year for the inspector general.
在5年内为美国芯片基金拨款500亿美元。资金必须用于实施商务部半导体激励计划，以发展国内制造能力和研发，以及经2021财年《国防授权法案》许可的劳动力发展项目（第9902条和第9906条）。每个财政年度，高达2%的资金用于报酬和开支、管理和监督，其中每年有500万美元用于总监。
Within the fund, the following appropriations are available:
基金拨款作如下用途：
oIncentive Program: $39 billion allocated over 5 years to implement the programs authorized in Sec. 9902, of which $2 billion is explicitly provided to focus solely on legacy chip production to advance economic and national security interests. These chips are essential to the auto industry, the military, and other critical industries. Within the incentive program, up to $6 billion may be used for the cost of direct loans and loan guarantees.
n$19 billion in FY22, including the $2 billion legacy chip production funding.
n$5 billion each year, FY23 through FY26
激励计划：在5年内分配390亿美元用于实施2021财年《国防授权法案》第9902条许可的项目，其中20亿美元明确用于专注于传统芯片生产，以促进经济和国家安全利益。这些芯片对于汽车工业、军事和其他关键行业至关重要。在激励计划中，最高60亿美元可用于直接贷款和贷款担保。
n在2022财年拨款190亿美元，包括20亿美元用于资助传统芯片生产；
n2023-2026财年每年拨款50亿美元。
oCommerce R&D and workforce development programs: $11 billion appropriated over 5 years to implement programs authorized in Sec. 9906, including the National Semiconductor Technology Center (“NSTC”), the National Advanced Packaging Manufacturing Program, and other R&D and workforce development programs authorized in Sec. 9906.
n$5 billion in FY22
·$2 billion for NSTC
·$2.5 billion for advanced packaging
·$500 million for other related R&D programs
nFor use across the NSTC, advanced packaging, and other related R&D programs, the following would be provided:
·$2billion in FY23
·$1. 3billion in FY24
·$1. 1 billion in FY25
·$1. 6 billionin FY26
商业研发和劳动力发展项目：5年内拨款110亿美元，用于实施2021财年《国防授权法案》第9906条许可的项目，包括国家半导体技术中心、国家先进封装制造项目以及第9906条规定的其他研发和劳动力开发项目。
n2022财年拨款50亿美元；
·国家半导体技术中心拨款20亿美元；
·国家先进封装项目拨款25亿美元；
·其他相关研发项目拨款5亿美元。
n为促进国家半导体技术中心、高级包装和其他相关研发项目中使用，将提供以下资助：
·2023财年拨款20亿美元；
·2024财年拨款13亿美元；
·2025财年拨款11亿美元；
·2026财年拨款16亿美元。
·$2 billion for a CHIPS for America Defense Fund: Funding would be appropriated for the Microelectronics Commons, a national network for onshore, university-based prototyping, lab-to-fab transition of semiconductor technologies—including Department of Defense-unique applications—and semiconductor workforce training.
拨款20亿美元成立美国国防芯片基金：该基金将用于微电子公用事业，一个为国内市场、高校背景的原型开发、半导体技术从实验室到工厂的过渡—包括国防部的独特应用—和半导体人力培训的全国性网络。
·$500 million for a CHIPS for America International Technology Security and Innovation Fund: Funding would be allocated over 5 years to the Department of State, in coordination with the U.S. Agency for International Development, the Export-Import Bank, and the U.S. International Development Finance Corporation, for the purposes of coordinating with foreign government partners to support international information and communications technology security and semiconductor supply chain activities, including supporting the development and adoption of secure and trusted telecommunications technologies, semiconductors, and other emerging technologies.
拨款5亿美元成立美国国际技术安全和创新芯片基金：资金将在5年内拨付至国务院，与美国国际开发署、进出口银行和美国国际开发金融公司协调，目的是与外国政府合作伙伴协调，支持国际信息和通信技术安全和半导体供应链活动，包括支持开发和采用安全可靠的电信、半导体和其他新兴技术。
·$200 million for a Creating Helpful Incentives to Produce Semiconductors (CHIPS) for America Workforce and Education Fund: Funding provided to the National Science Foundation, spread over five years, to promote growth of the semiconductor workforce. A highly skilled domestic workforce is vital to the success of new and expanded facilities created through the CHIPS Act incentives. The semiconductor industry is projected to need an additional 90,000 workers by 2025.
拨款2亿美元用于为美国劳动力和教育基金会采取有益的半导体（芯片）生产激励措施：款项分五年拨付给国家科学基金会，以促进半导体行业的劳动力增长。国内高级技能人才对于通过《2022年芯片与科学法案》激励所创造的新建和扩建设施的成功至关重要。预计到2025年，半导体行业还需要新增90000名劳动者。
Sec. 103—Semiconductor incentives.
Amends the William M. (Mac) Thornberry National Defense Authorization Act for Fiscal Year 2021 (Public Law 116-283) to—
1) Clarify the eligibility of upstream suppliers, essential to building strong domestic semiconductor manufacturing ecosystems, to receive CHIPS funding;
2) Ensure, in the provision of incentives for semiconductor manufacturing, consideration of a broad range of semiconductors and the relevance of the technology to supply chain vulnerabilities;
3) Authorize $2 billion in additional financial incentives for manufacturing of mature technology nodes, with priority for critical manufacturing industries, such as the automotive industry;
4) Provide the Department of Commerce with other transaction authority to enable efficient execution of CHIPS awards; and
5) Require that construction projects funded under the CHIPS Act are subject to Section 602 of the Public Works and Economic Development Act of 1965 (42 U.S.C. 3212).
Prohibit the recipients of Federal incentive funds from expanding or building new manufacturing capacity for certain advanced semiconductors in specific countries that present a national security threat to the United States. To ensure that these restrictions remain current with the status of semiconductor technology and with U.S. export control regulations, the Secretary of Commerce, in coordination with the Secretary of Defense and the Director of National Intelligence, would be required to regularly reconsider, with industry input, which technologies are subject to this prohibition.
第103条半导体激励
将William M.（Mac）Thornberry2021财年《国防授权法案》（公法116-283）作如下修订：
1）明确上游供应商获得芯片资金的资格，这对于建立强大的国内半导体制造生态系统至关重要；
2）在对半导体制造行业提供激励措施时，确保考虑到广泛的半导体领域以及技术与供应链脆弱性的相关性；
3）批准20亿美元的额外财政奖励，用于成熟技术节点的制造，优先用于汽车行业等关键制造业；
4）向商务部提供其他交易权限，以便有效执行芯片奖励；和
5）要求根据《2022年芯片与科学法案》资助的建筑项目符合1965年《公共工程和经济发展法案》第602节（《美国法典》第42卷第3212节）的规定。
禁止联邦激励资金的获得者在对美国构成国家安全威胁的特定国家扩大或建设某些先进半导体的新制造能力。为确保这些限制与半导体技术现状和美国出口管制条例保持一致，商务部长将与国防部长和国家情报局局长协调，利用行业投入，定期重新审议哪些技术受此禁令的约束。
Sec. 104—Opportunity and Inclusion
Requires the Department of Commerce to establish activities and assign personnel to ensure that the recipients of CHIPS manufacturing incentives meet their commitments to increase the participation of economically disadvantaged individuals in the semiconductor workforce. Such personnel would also serve as a resource to support the participation of minority-owned businesses, veteran-owned businesses, and women-owned businesses, in CHIPS-funded projects.
第104条机遇和包容
要求商务部采取措施并指派人员，确保芯片制造奖励资金的获得者履行其承诺，提升经济弱势群体在半导体劳动力市场中的参与度。他们将成为支持少数民族企业、退伍军人企业和女性企业参与芯片资助项目的途径。
Sec. 105—Additional GAO reporting requirements.
Expands the scope of the Government Accountability Office report already required under the FY21 NDAA to include an evaluation of potential Government steps to avoid semiconductor shortages; to describe efforts taken to hire individuals from disadvantaged populations into the semiconductor workforce; and to detail how funded projects support the needs of critical infrastructure industries.
第105条其他审计总署报告要求
扩大2021财年《国防授权法案》已规定的政府问责办公室的报告范围，使之包括对避免半导体短缺的潜在政府措施的评估；陈述从弱势群体中雇佣劳动者加入半导体人才队伍所采取的措施；并详细说明受资助项目是如何支持关键基础设施行业的需求。
Sec. 106—Appropriations for wireless supply chain innovation.
Appropriates $1.5 billion for the Public Wireless Supply Chain Innovation Fund, to spur movement towards open-architecture, software-based wireless technologies, funding innovative, ‘leap-ahead’ technologies in the U.S. mobile broadband market. The fund would be managed by the National Telecommunications and Information Administration (NTIA), with input from the National Institute of Standards and Technology, Department of Homeland Security, and the Intelligence Advanced Research Projects Activity, among others.
第106条拨款资助无线供应链创新拨款
向公共无线供应链创新基金拨款15亿美元，用以推动开放式架构、软件无线技术的发展，为美国移动宽带市场创新“超前”技术提供资金。这笔拨款将由美国国家电信和信息管理局（NTIA）管理，通过国家标准与技术研究院、国土安全部和情报高级研究项目活动等发放。
Sec. 107—Advanced manufacturing investment credit.
Creates a 25 percent investment tax credit for investments in semiconductor manufacturing and includes incentives for the manufacturing of semiconductors, as well as for the manufacturing of the specialized tooling equipment required in the semiconductor manufacturing process. Taxpayers may elect to treat the credit as a payment against tax (“direct pay”).
第107条先进制造业投资税收优惠
为半导体制造业的投资设置25%的投资税收减免，包括半导体制造以及半导体制造过程中所需的专用工具设备的制造奖励。纳税人可选择将减免部分视作抵税（“直接支付”）。
The credit is provided for property that is placed in service after December 31, 2022, and for which construction begins before January 1, 2027.
该税收优惠适用于2022年12月31日之后投入使用且在2027年1月1日之前开工的工程。